ssf 6114 ? silikron semiconductor co., ltd. 2011. 11 . 0 5 version: 1. 1 page 1 of 8 www.silikron.com main product characteristics: features and benefits: description: absolute max rating: symbol parameter max. units i d @ tc = 25c continuous drain current, v gs @ 10v 60 a i d @ tc = 100c continuous drain current, v gs @ 10v 48 i dm pulsed drain current 240 p d @tc = 25c power dissipation 1 15 w linear derating factor 0. 74 w/c v ds drain - source voltage 60 v v gs gate - to - source voltage 20 v e as single pulse avalanche energy @ l=0. 1 mh 235 mj i a s avalanche current @ l=0. 1 mh 68 a t j t stg operating junction and storage temperature range - 55 to + 1 75 c v dss 60 v r ds (on) 10 mohm(typ.) i d 60 a to220 marking and pin assignment schematic diagram ? advanced trench mosfet process technology ? special designed for pwm, load switching and general purpose applications ? ultra low on - resistance with low gate charge ? fast switching and reverse body recovery ? 175 operating temperature it utilizes the latest trench processing techniques to ach ieve the high cell density and reduces the on - resistance with high repetitive avalanche rating . these features combine to make this design an extremely efficient and reliable device for use in power switching application and a w ide variety of other applications SSF6114 ssft3904u ssft3904u
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 2 of 8 www.silikron.com thermal resistance symbol characterizes typ. max. units r jc junction - to - case 1. 5 /w r ja junction - to - ambient ( t 10s) 62 /w junction - to - ambient (pcb mounted, steady - state) 40 /w electrical characterizes @t a =25 unless otherwise specified symbol parameter min. ty p. max . units conditions v (br)dss drain - to - source breakdown voltage 60 v v gs = 0v, id = 250a r ds(on) static drain - to - source on - resistance 10 14 m v gs =10v,i d = 3 0 a 1 7 t j = 1 25 v gs(th) gate threshold voltage 2 4 v v ds = v gs , i d = 250 a 2.53 t j = 1 25 i dss drain - to - source leakage current 1 a v ds = 60 v,v gs = 0v 50 t j = 125 c i gss gate - to - source forward leakage 1 00 na v gs = 20 v - 1 00 v gs = - 20 v q g total gate charge 62 nc v ds = 30 v, i d = 30 a, v gs = 10 v q gs gate - to - source charge 1 7 q gd gate - to - drain("miller") charge 2 0 t d(on) turn - on delay time 1 6 ns v gs = 10 v, vds= 30 v, r gen = 2.55 , i d = 2 a t r rise time 13 t d(off) turn - off delay time 38.5 t f fall time 8 .6 c iss input capacitance 3265 pf v gs = 0v v ds = 25 v ? = 1m hz c oss output capacitance 173 c rss reverse transfer capacitance 163 source - drain ratings and characteristics symbol parameter min. typ. max . units conditions i s c ontinuous source current (body diode) 60 a mosfet symbol showing the integral reverse p - n junction diode. i sm pulsed source current ( body diode ) 240 a v sd diode forward voltage 0. 9 1.3 v i s = 40 a, v gs =0v t rr reverse recovery time 2 4.3 ns t j = 25c , i f = 6 0 a, di/dt = 10 0a/s q rr reverse recovery charge 26.5 nc
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 3 of 8 www.silikron.com test circuits and waveforms switch waveforms: notes : the maximum current rating is limited by bond - wires. repetit ive rating; pulse width limited by max. junction temperature. the power dissipation pd is based on max. junction temperature , using junc tion - to - case thermal resistance. the value of r j a is measured with the device mounted on 1in 2 fr - 4 bo ard with 2oz. copper, in a still air environment with ta =25c these curves are based on the junction - to - case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max ) =175 c.
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 4 of 8 www.silikron.com t ypical electrical characteristics figure 1: body - diode characteristics figure 2: typical transfer characteristics figure 3: on - resistance vs. junction temperature figure 4 : breakdown voltage vs. junction temperature figure 6 : ga te - charge characteristics figure 5 : maximum drain current vs. junction temperature
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 5 of 8 www.silikron.com typical thermal characteristics figure 8 : normalized thermal transient impedance curve figure 7 : safe operation area
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 6 of 8 www.silikron.com mechanical data min nom max min nom max a - 1.300 - - 0.051 - a1 2.200 2.400 2.600 0.087 0.094 0.102 b - 1.270 - - 0.050 - b1 1.270 1.370 1.470 0.050 0.054 0.058 c - 0.500 - - 0.020 - d - 15.600 - - 0.614 - d1 - 28.700 - - 1.130 - d2 - 9.150 - - 0.360 - e 9.900 10.000 10.100 0.390 0.394 0.398 e1 - 10.160 - - 0.400 - p - 3.600 - - 0.142 - p1 1.500 0.059 e l 12.900 13.100 13.300 0.508 0.516 0.524 ?1 - 7 0 - - 7 0 - ?2 - 7 0 - - 7 0 - ?3 - 3 0 - 5 0 7 0 9 0 ?4 - 3 0 - 1 0 3 0 5 0 symbol dimension in millimeters dimension in inches 2.54bsc 0.1bsc to220 package outline dimension_gn e d d1 p a ? 1 d2 a1 c e b b1 ? 2 ? 3 l ? 4 p1 e1
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 7 of 8 www.silikron.com ordering and marking information device marking: ssf 6114 package (available) to 220 operating temperature range c : - 55 to 175 oc devices per unit package type units/ tube tubes/inner box units/inner box inner boxes/carton box units/carton box to 220 50 20 1000 6 6000 reliability test program test item conditions duration sample size high temperature reverse bias(htrb) t j =125 to 175 @ 80% of max v dss /v ces /vr 168 hours 500 hours 1000 hours 3 lots x 77 devices high temperature gate bias(htgb) t j = 125 to 1 75 @ 100% of max v gss 168 hours 500 hours 1000 hours 3 lots x 77 devices
ssf 6114 ? silikron semiconductor co., ltd . 2011. 11 . 0 5 version: 1. 1 page 8 of 8 www.silikron.com attention: any and all silikron pr oducts described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life - support systems, aircraft's control systems, or other ap plications whose failure can be reasonably exp ected to result in serious physical and/or material damage. consult with your silikron representative nearest you before using any silikron products described or contained herein in such applications. silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all silikron products described or contained herein. specifications of any and all silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customers products or equipment. to verify s ymptoms and states that cannot be evaluated in an independent device, th e customer should a lways evaluate and test devices mounted in the customers products or equipment. silikron semiconductor co.,ltd. strives to supply high - quality high - reliability products. however, any and all semiconductor products fail with some probability. it is possible that these probabilistic failures could give rise to accident s or events t hat could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. when designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. in the event that any or all silikron products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. no part of this publication may be reproduced or tran smitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of silikron semiconductor co.,ltd. information (incl uding circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. silikron believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringem ents of intellectual property rights or other rights of third parties. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equipment, refer to the "delive ry specification" for the silikron product that you intend to use. this catalog provides information as of dec, 2008. specifications and information herein are subject to change without notice. customer service worldwide sales and service : sales@silik ron.com technical support: technical@silikron.com suzhou silikron semiconductor corp. building 11a suchun industrial square, 428# xinglong street, suzhou p.r. chin a tel: (86 - 512) 62560688 fax: (86 - 512) 65160705 e - mail: sales@silikron.com
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